同义词 X
  • 封装

    译词

  • package (45022)
  • packaging (5808)
  • capsulation (5460)
  • encapsulation (5313)
  • encapsulating (3137)
  • packet (2949)
  • potting (435)
  • wrapper (307)
  • envelope (289)
  • footprint (219)
  • canning (47)
  • masking (22)
  • packaging structures (21)
  • cladding (17)
  • seal materials (2)
  • package

    n.    

    变形:   english【复】

  • 1同样,根据本发明的第二方面,在根据第一方面的压力传感器封装体中,较佳地,凹槽从压力进入管的用于引入压力介质的入口设置到其到达压力传感器芯片附近的位置。
     Also, according to a second aspect of the invention, it is preferable in the pressure sensor package according to the first aspect that the groove is provided from an entrance of the pressure inlet pipe from which the pressure medium is introduced to a location in which it reaches the vicinity of the pressure sensor chip.
     来源:专利文献   中文专利号:CN102435379A   英文专利号:US2012073381

  • packaging

    n.    

    变形:   english【复】

  • 1根据系统要求,利用第一和第二级封装形式的任何组合配置的半导体封装的任何组合、以及其它电子部件,可以被连接到PCB 52。
     Depending upon the system requirements, any combination of semiconductor packages, configured with any combination of first and second level packaging styles, as well as other electronic components, can be connected to PCB 52.
     来源:专利文献   中文专利号:CN101996893A   英文专利号:US2011031634

  • capsulation

    n.    

    变形:   english【复】

  • 1另外,金属封装体40包括不止一层,例如可以将由Au构成的粘合层施加到铜金属化40的顶部上。
     Additionally, the metal encapsulation 40 may comprise more than one layer, e.g. an adhesion layer of Au could be applied on top of the copper metallization 40.
     来源:专利文献   中文专利号:CN101208789A   英文专利号:US2010164079

  • encapsulation

    n.    

    变形:   english【复】

  • 1作为例子,图22示出在封装模块A的上部外表面或顶面8上的结构化的金属喷镀触点。
     FIG. 22 shows for example a structured contact metallization 24 on the upper outer surface or top surface 8 of the encapsulation module A.
     来源:专利文献   中文专利号:CN101616864A   英文专利号:US2010290199

  • encapsulating

    n.    

    变形:   english【复】

  • 1在该LED管芯之上模制透明的基本半球的第一层且封装该LED管芯,该第一层具有第一折射率;
     molding a transparent substantially hemispherical first layer over and encapsulating the LED die, the first layer having a first index of refraction;
     来源:专利文献   中文专利号:CN102460748A   英文专利号:US2010308354

  • packet

    n.    

    变形:   english【复】

  • 1接收指示,所述指示是关于由所述第一网络实体对所述封装的分组流进行的检测;
     receiving an indication of a detection of the encapsulated packet flow by the first network entity;
     来源:专利文献   中文专利号:CN102246547A   英文专利号:US2010142373

  • potting

    n.    

    变形:   english【复】

  • 1盖48或扩散器52可任选地设置在封装头部40上面,与第二开口26连通。
     A cap 48 or diffuser 52 may optionally be provided over the potting head 40 in communication with the second opening 26.
     来源:专利文献   中文专利号:CN103153446A   英文专利号:US2012091602

  • wrapper

    n.    

    变形:   english【复】

  • 1在ULPI封装器4、ULPI PHY6、USB分析器10和USB主机之间发生同样的双向USB信号流。
     The same bi-directional flow of USB signals occurs between ULPI wrapper 4, ULPY PHY 6, USB analyzer 10 and USB host 8.
     来源:专利文献   中文专利号:CN103201729A   英文专利号:US2012110217

  • envelope

    n.    

    变形:   english【复】

  • 1由纸料得到的包封件18由超声波熔接设备19纵向密封,并在管状心轴16的出口端处用横向密封装置20来将其横向密封。
     The envelope 18 obtained from the web of paper material is sealed lengthwise by the ultrasonic welders 19, and crosswise, at the outlet end of the tubular mandrel 16, by the transverse sealing means 20.
     来源:专利文献   中文专利号:CN101636320A   英文专利号:US2010101189

  • footprint

    n.    

    变形:   english【复】

  • 1沟道宽度参数可限定一范围,工具在集成电路的设计流程期间基于一个或多个功率标准在不改变封装的情况下,在该范围内将沟道宽度在最大驱动器尺寸和最小驱动器尺寸之间变化。
     The channel width parameter may define a range within which a tool varies the channel width between the maximum driver size and the minimum driver size during a design flow of the integrated circuit based upon one or more power criteria without changing the footprint.
     来源:专利文献   中文专利号:CN102346792A   英文专利号:US2012023473

  • canning

    n.    

    变形:   english【复】

  • 1另一方面,在图4(b)所示的例子中,扫描线驱动电路61以及数据线驱动电路62不安装在元件基板30上,而是COF(Chip On Film,薄膜载芯片)封装(或TAB(Tape Automated Bonding,带式自动接合)安装)在柔性基板202、203上。
     On the other hand, in the example shown in FIG. 4B, the scanning line drive circuit 61 and the data line drive circuit 62 are not installed on the element substrate 30, but installed on the flexible substrates 202 and 203 via a COF (Chip On Film) (or a TAB (Tape Automated Bonding)).
     来源:专利文献   中文专利号:CN102097057A   英文专利号:US2011134162

  • masking

    n.    

    变形:   english【复】

  • 1使用各种遮掩技术及处理技术,裸片705可经进一步处理以包括功能电路,使得每一裸片705制作为具有与晶片700上的其它裸片相同的功能性及经封装结构的集成电路。
     Using various masking and processing techniques, dies 705 can be further processed to include functional circuitry such that each die 705 is fabricated as an integrated circuit with the same functionality and packaged structure as the other die on wafer 700.
     来源:专利文献   中文专利号:CN102341890A   英文专利号:US2010193897

  • packaging structures

    n.    

    变形:   english【复】

  • 1作为用于微波装置的最优选类型的共振器之一,在微波封装结构中已经实现各种空腔共振器。
     As one of the most preferred types of resonators for microwave devices, various cavity resonators have been realized in microwave packaging structures.
     来源:专利文献   中文专利号:CN102683785A   英文专利号:US2012206219

  • cladding

    n.    

    变形:   english【复】

  • 1图2示出了在其封装层1a内有一个芯1b和施压元件1c的第一保持偏振光纤1,和在其封装层2a内有一个芯2b和施压元件2c的第二保持偏振光纤2。
     FIG. 2 shows the first polarization-maintaining optical fiber 1 having a core 1b and stress applying members 1c in its cladding layer 1a, and the second polarization-maintaining optical fiber 2 having a core 2b and stress applying members 2c in its cladding layer 2a.
     来源:专利文献   中文专利号:CN1131279A   英文专利号:US5611015

  • seal materials

    n.    

    变形:   english【复】

  • 1可替换地,塞密封件(未示出)可以从顶壁52的内表面和/或内帽50的裙部54悬垂下来,并且用于封装容器70的内容物,而不需要附加衬垫、可延展密封材料、铝箔密封件或者如本领域已知的用于使密封件落座而接触容器颈部结束端的其他类型的密封件。
     Alternatively, a plug seal (not shown) may depend from the interior surface of top wall 52 and/or skirt 54 of the inner cap 50 and serve to seal-in the contents of container 70 without need for additional liners, malleable seal materials, foil seals or other types of seals for seating the closure in contact with the container neck finish, as is well known in the art.
     来源:专利文献   中文专利号:CN102470959A   英文专利号:US2011006030

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